Product Highlights n ROL0 flux classification n Optimized for Lead-free and standard alloy systems n Designed for LGA, BGA, and CSP components n Halogen free per EN14582 test method n Excellent wetting on all common surface finishes n Clear residue n Low voiding n REACH compliant Application VS-213-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. VS-213-TF may be used for BGA sphere attachment and reballing. VS-213-TF is also designed to work on all flip chip bumping and chip scale packaging sites.
Compatible Alloys Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 42Sn/58Bi 138 280 42Sn/57Bi/1Ag 138 280 96.5Sn/3.0Ag/0.5Cu 217-220 423-428 99.0Sn/0.3Ag/0.7Cu 217-221 423-430 96.5Sn/3.5Ag 221 430 99.3Sn/0.7Cu 227 441 95Sn/5Sb 235-240 455-464 95Sn/5Ag 221-245 430-473
Cleaning VS-213-TF is a no clean tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, VS-213-TF can be cleaned using commercially available flux residue removers such as Inventec Topklean EL10F, PROMOCLEAN DISPER 605,PROMOCLEAN DISPER 607, and for Batch Cleaning TOPKLEAN EL7
Storage and Handling Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.
Recommended Profile This profile is designed to serve as a starting point for process optimization using VS-213-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.